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| 3.5pF Unidirectional TVS Array for ESD Protection SPATM Silicon Protection Array Products RoHS Pb GREEN SP1010 Lead-Free/Green Series Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protection highspeed signal pins. Pinout I/O (1) GND I/O (2) I/O (4) GND I/O (3) Features * ESD, IEC61000-4-2, 8kV contact, 15kV air * Lightning, IEC61000-4-5, 1A (tp=8/20s) * Low capacitance of 3.5pF (TYP) per I/O * Low leakage current of 1A (MAX) at 5V * Tiny uDFN package (1.25mm x 1.0mm x 0.5mm) * EFT protection IEC61000-4-4, 40A (5/50ns) uDFN-6 (1.25x1.0x0.5mm) Functional Block Diagram Applications * Netbook * Ultra mobile PC * Mobile phone * Portable navigation device * MP3/PMP * Digital camera 1 2 3 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 1 SP1010 Lead-Free/Green Series Lead-Free/Green SP1010 6 5 4 * Notebook * Portable medical device SPATM Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection Absolute Maximum Ratings Symbol IPP TOP TSTOR Peak Pulse Current (tp=8/20s) Operating Temperature Storage Temperature Parameter Value 1.0 -40 to 85 -60 to 150 Units A C C CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 10s) Rating -65 to 150 150 260 Units C C C Electrical Characteristics (TOP=25C) Parameter Reverse Voltage Drop Reverse Standoff Voltage Reverse Leakage Current ESD Withstand Voltage1 Symbol VR VRWM ILEAK VESD Test Conditions IR = 1mA IR1A VR = 5V IEC61000-4-2 (Contact Discharge) IEC61000-4-2 (Air Discharge) Reverse Bias = 0V Reverse Bias = 2.5V 8 15 6 3.5 7 0.1 Min 6.0 Typ 7 .5 Max 8.0 6 1 Units V V A kV kV pF pF Diode Capacitance1 Notes: CD 1. Parameter is guaranteed by design and/or device characterization. SP1010 Lead-Free/Green Series 2 (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 3.5pF Unidirectional TVS Array for ESD Protection SPATM Silicon Protection Array Products Capacitance vs. Reverse Bias 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Insertion Loss (S21) I/O to GND 5 0 -5 Capacitance (pF) Attenuation (dB) -10 -15 -20 -25 -30 10 100 1000 10000 DC Bias (V) Frequency (MHz) Application Example Input Keyboard Controller D1 D2 D3 D4 SP1010-04UTG Shield Ground Signal Ground (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 3 SP1010 Lead-Free/Green Series Lead-Free/Green SP1010 Outside World SPATM Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection Soldering Parameters Reflow Condition - Temperature Min (Ts(min)) Pre Heat - Temperature Max (Ts(max)) - Time (min to max) (ts) Average ramp up rate (Liquidus) Temp (TL) to peak TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) - Temperature (tL) Pb - Free assembly 150C 200C 60 - 180 secs 3C/second max 3C/second max 217C 60 - 150 seconds 250+0/-5 C 20 - 40 seconds 6C/second max 8 minutes Max. 260C Peak Temperature (TP) Time within 5C of actual peak Temperature (tp) Ramp-down Rate Time 25C to peak Temperature (TP) Do not exceed Package Dimensions - uDFN-6 (1.25x1.0x0.5mm) Top View D A Bottom View 0.05 C 456 E L uDFN-6 (1.25x1.0x0.5mm) Symbol A A1 A3 b D Millimeters Min 0.45 0.00 0.15 1.20 0.95 0.4 REF 0.25 0.35 Max 0.55 0.05 0.25 1.30 1.05 Min 0.018 0.000 0.006 0.047 0.037 0.016 REF 0.010 0.014 Inches Max 0.022 0.002 0.010 0.051 0.041 - 654 0.05 C Pin 1 chamfer 0.10 x 45' Pin 1 Index Area 123 B 321 0.127 REF 0.005 REF Side View 0.05 C A A1 A3 Seating plane C D2 E E2 e L b 0.10 M C A B 0.05 M C SP1010 Lead-Free/Green Series 4 (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 3.5pF Unidirectional TVS Array for ESD Protection SPATM Silicon Protection Array Products Part Numbering System Product Characteristics Lead Plating G= Green T= Tape & Reel SP 1010 - 04 U T G Silicon Protection Array Series Number of Channels Package U: uDFN-6 Pre-Plated Frame Copper Alloy 0.0004 inches (0.102mm) Silicon Molded Epoxy UL94-V-0 Lead Material Lead Coplanarity Subsitute Material Body Material Flammability Notes : Part Marking System H*4 H*4 Product Series H = SP1010 Number of Channels Assembly Site (Varies) 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Ordering Information Part Number SP1010-04UTG Package uDFN-6 (1.25x1.0x0.5mm) Marking H*4 Min. Order Qty. 3000 Embossed Carrier Tape & Reel Specification - uDFN-6 (1.25x1.0x0.5mm) Symbol Millimeters Min 1.65 3.45 0.50 3.90 7 .90 1.95 1.09 1.42 0.71 0.25 TYP Max 1.85 3.55 0.65 4.10 8.30 2.05 1.19 1.52 0.81 Min 0.06 0.14 0.02 0.15 0.31 0.08 0.04 0.06 0.03 Inches Max 0.07 0.14 0.03 0.16 0.33 0.08 0.05 0.06 0.03 D P2 E t E F D1 D P0 10P0 W P2 A0 B0 1.50 MIN 40.0 +/- 0.20 0.06 MIN 1.57 +/- 0.01 B0 D1 A0 K0 t P0 0.01 TYP K0 (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 5 SP1010 Lead-Free/Green Series Lead-Free/Green SP1010 F W SPATM Silicon Protection Array Products 3.5pF Unidirectional TVS Array for ESD Protection SP1010 Lead-Free/Green Series 6 (c)2009 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. |
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